IF / News – Daily News / Weekly Summary / Regular Discussion

4-13 #Gamer : Apple is allegedly focusing on foldable products; OPPO, OnePlus, and realme are reportedly working on the ultrasonic FoD; Huawei is reportedly building a giant R&D center near Shanghai; etc.

Intel and Altera have announced new AI-optimized processors and field programmable gate arrays (FPGAs) for edge computing. By introducing a range of edge-optimized Intel Core Ultra processors, Intel Core processors, and Intel Atom processors, alongside Agilex 5 FPGAs, the companies… Read more ›

4-5 #Qingming : TSMC has resumed work at its fabrication sites in Taiwan after an earthquake-led shutdown; Infinix is allegedly developing its first foldable smartphone; Google is allegedly considering charging for AI-powered search; etc.

Taiwan Semiconductor Manufacturing Company (TSMC) has resumed work at its fabrication sites in Taiwan after an earthquake-led shutdown. The company was able to recover quickly, with no damage to critical chipmaking equipment, ensuring minimal disruption to chip supply. Despite initial… Read more ›

4-1 #Turbulence : The demand for mature wafer foundry processes is weak; GigaDevice plans to participate in CXMT’s latest capital increase; Micron said that its HBM production capacity in 2024 has already been sold out; etc.

In the era of rapid AI advancements, the need for more computing power has become crucial for future progress. With that, we will witness a drastic increase in transistor counts in semiconductors, potentially reaching the 1T mark by the end… Read more ›

3-30 #BestInnovation : Intel has announced its new AI PC Developer Program; China Mobile has announced the commercial launch of 5G-Advanced; Apple and Tencent are reportedly to become partners; etc.

Qualcomm has announced S3 Gen 3 and S5 Gen 3 Sound platforms. The Qualcomm S3 Gen 3 Sound platform offers an unprecedented level of customization and flexibility to OEMs, via support for a wide range of 3rd party feature enhancements… Read more ›

3-23 #LetItGo : MediaTek and Nvidia collaborate on Dimensity Auto Cockpit platforms; Samsung’s memory semiconductor business is reportedly expected to recover in 2024; Samsung is “reviewing” bringing Galaxy AI features to the Galaxy S22 series; etc.

Samsung Electronics will supply its next-generation Mach-1 artificial intelligence chips to Naver by the end of 2024 in a deal worth up to KRW1T (USD752M). With the contract, Naver will significantly reduce its reliance on Nvidia for AI chips. Samsung… Read more ›

3-16 #Decade : MediaTek is now turning its focus to the fast-growing premium segment; SMIC is rumored to be assembling a team dedicated to 3nm chip development; Samsung is allegedly looking to bring back the squarish design for its smartwatches; etc.

According to Anku Jain, managing director, MediaTek India, MediaTek is now turning its focus to the fast-growing premium segment with its latest 5G chipsets, having attained a dominant 50% market share, outpacing rival Qualcomm in the highly competitive India smartphone… Read more ›

3-10 #PricelessSmile : Apple is working on a 20.3” foldable screen MacBook; Huawei and vivo have signed a global patent cross-licensing agreement; Sony might be considering an exit from the Chinese smartphone market; etc.

The Centre for Development of Telematics (C-DOT) has signed an MoU with Qualcomm to provide wireless IC designers to stimulate innovation and accelerate commercialization as Qualcomm India is ramping up investments under a newly appointed leader. Under the partnership, C-DOT,… Read more ›

3-2 #Memories : Motorola has announced a new partnership with Corning; Xiaomi and Leica Camera AG have jointly established Xiaomi x Leica Optical Institute; OPPO is coming back to Europe after resolving a patent dispute with Nokia; etc.

MediaTek has launched the Helio G91 chipset, an upgrade from the Helio G88 introduced 3 years ago. This new system-on-chip (SoC) is designed to boost the performance and capabilities of budget smartphones, offering support for 90Hz FHD+ displays and a… Read more ›

2-27 #SpoilMyself : Qualcomm has announced the Qualcomm AI Hub; Intel has revealed that Microsoft plans to use its services to manufacture a custom computing chip; Lenovo has revealed ThinkBook Transparent Display concept laptop; etc.

Qualcomm has announced the Qualcomm AI Hub, a library of pre-optimized models for deployment on Snapdragon and Qualcomm platforms. for developers. It allows developers to quickly implement AI models in their apps. The company says that these optimized models should… Read more ›

2-24 #ChapGohMei2024 : Samsung has secured a 2nm AI chip order from Preferred Networks; Western Digital and Kioxia are allegedly progressing in their merger talks; Meizu is quitting the smartphone business; etc.

TSMC is on track to move 2nm process technology to risk production at its new fab on the Baoshan campus of the Hsinchu Science Park (HSP) in northern Taiwan in 4Q24, followed by volume production in the 2Q25, according to… Read more ›

2-14 #ValentinesDay : Samsung and Huawei are reportedly ramping up efforts to create new foldable designs; Some smartphone manufacturers are reportedly preparing to stop making exclusive partnerships for imaging systems; etc.

Facebook owner Meta Platforms allegedly plans to deploy into its data centers in 2024 a new version of a custom chip aimed at supporting its artificial intelligence (AI) push. The chip, a second generation of an in-house silicon line Meta… Read more ›

2-11 #Drama : SMIC is said to have set up a new semiconductor production line in Shanghai; TSMC is said to take monthly production from 60K to 100K monthly wafers; Wingtech has reportedly received a major smartphone order from Samsung; etc.

Google is allegedly testing the Tensor G4 chip paired with a whopping 16GB of RAM in the Pixel Fold 2. Earlier prototypes of the foldable featured Google’s Tensor G3 chipset, codenamed “zuma”, but recent prototypes have shifted to the rumored… Read more ›

2-6 #RunRunRun : Huawei is rumored to be developing a tri-foldable smartphone; Nokia and vivo have signed a multi-year 5G patent license agreement; Qualcomm is expecting a modest recovery for the industry in 2024; etc.

Qualcomm is expecting a modest recovery for the industry in 2024, with phone shipments getting stronger but the market for internet-connected appliances remaining sluggish. Phone shipments, which declined in 2023, will be “flat to up slightly” in 2024, the company… Read more ›

2-5 #DisplayUpFace : Qualcomm has signed a multiyear deal with Samsung; MediaTek is reportedly offering Samsung a discounted deal on its chips for use in budget-friendly phones; Apple is reportedly considering launching its first foldable in the next few years; etc.

Qualcomm has revealed that it has signed a multiyear deal with Samsung to supply Snapdragon processors for future flagship Galaxy smartphones. The agreement starts in 2024 and talks about the Galaxy S24 series. So, we can expect at least a… Read more ›

1-27 #Tired : Samsung is allegedly working on an entry-level model of its flagship foldable phone; Samsung has showcased the world’s first transparent MicroLED display; Google and AT&T have joined a strategic investment in AST SpaceMobile; etc.

Foxconn will partner with tech firm HCL Group for a semiconductor assembly and testing facility in India. The firms will set up an outsourced assembly and testing (OSAT) unit in the south Asian nation. An OSAT plant packages, assembles and… Read more ›

1-17 #InFear : Samsung Display has unveiled display that can be easily folded in and out; TCL has announced NXTPAPER 3.0; Samsung has announced that its partnership with Microsoft is set to bring “Intelligent Connectivity”; etc.

Samsung Display has unveiled a new generation of products that can be easily folded in and out, as well as rollable and slidable display technologies. The “Flex In&Out Flip” is a foldable device with a flip-phone design. Its unique in-and-out… Read more ›