IF / News – Daily News / Weekly Summary / Regular Discussion

10-12 #AfterHoliday : Qualcomm has confirmed that hackers exploited a zero-day; Samsung reportedly expects to ship about 22M units of the Galaxy S25 lineup by 1H25; Samsung may start charging for certain Galaxy AI features in 2025; etc.

GWM has officially announced the successful development and activation of its RISC-V automotive-grade MCU chip, the Zijing M100, which was jointly developed with multiple partners. It features a modular architecture with a reconfigurable core and a four-stage pipeline design that… Read more ›

9-29 #HappyNationalDay : Google has allegedly plans to keep TSMC as a long-term partner; Samsung Display has announced a USD1.8B investment to build an OLED display factory in Vietnam; Apple has reportedly delayed the deployment of under-display Face ID technology; etc.

Google has allegedly plans to keep TSMC as a long-term partner, with its Tensor G6 supposedly leveraging the advanced 2nm process. The Tensor G5 was previously reported in July of this year to have reached ‘tape-out’ status, with all that… Read more ›

9-23 #Thankful : Qualcomm has allegedly approached Intel to explore a potential acquisition; Apple is poised to equip iPhones with its self-developed 5G modem by 2025; TCL has announced new strategic partnership with Microsoft for AI; etc.

Unisoc has announced the successful upgrade of its 5G and 4G mobile platforms to Android 15. This update covers platforms such as the T820, T770, T765, T760, T750 for 5G, and T620, T619, T616, T615, T612, and T606 for 4G.… Read more ›

9-18 #MidAutumn : Samsung is allegedly cutting up to 30% of its overseas staff at some divisions; India‘ CCI revealed Amazon and Flipkart’s antitrust issue; Google and Apple have been slapped with astronomical fines in the EU; etc.

Qualcomm has allegedly explored the possibility of acquiring portions of Intel’s design business to boost the company’s product portfolio. Qualcomm has examined acquiring different pieces of Intel, which is struggling to generate cash and looking to shed business units and… Read more ›

8-31 #IndependenceDay : Xiaomi Unisoc have allegedly co-develop a 4nm chipset; Tecno is showcasing a trifold concept device; OPPO has showcased its own tri-fold smartphone concept; etc.

Xiaomi and Unisoc have allegedly joined forces to co-develop a 4nm chipset and a new development suggests the first Xiaomi-branded chipset from the collaboration is set to launch in early 2025. It will reportedly be fabbed on TSMC’s 4nm N4P… Read more ›

8-27 #AntiSocial : Xiaomi is allegedly developing a tri-foldable phone; Samsung has confirmed that it is working on a “double-foldable” phone; OnePlus, OPPO, and realme have allegedly started developing an ecosystem of phone accessories with magnets; etc.

Huawei was first included in the United States’ export control list in 2019, but several companies including Qualcomm were allowed to export certain 4G chips to it after obtaining exemptions from Washington. Before being blacklisted from trade, Huawei had been… Read more ›

8-3 #Run : Apple’s both foldable devices will allegedly be coming in 2026; Meizu wants to launch its first electric car within 2024; The EU’s AI law officially enters into force on 1 Aug 2024; etc.

Applied Materials was rejected for funding under the CHIPS act for a research and development center in Silicon Valley. Commerce Department officials allegedly rejected the chipmaking equipment maker’s bid to gain U.S. funding for a USD4B facility in Sunnyvale, California.… Read more ›

8-1 #JustRun : SK hynix has announced the development of its GDDR7; Apple to bolster its manufacturing presence in India; vivo has officially announced that it will launch a MR headset in 2025; etc.

Qualcomm has formally announced its new Snapdragon 4s Gen 2 chipset (SM4635). At its core the Snapdragon 4s Gen 2 features 2x Cortex-A78 cores clocked at 2.0GHz and 6x Crotex-A55 at 1.8GHz. All eight cores are downclocked by 200 MHz… Read more ›

7-28 #CaughtCold : MediaTek has filed a lawsuit against Huawei; Apple’s foldable concept allegedly “has moved beyond the conceptual stage”; Huawei’s tri-fold phone is expected to be released in 4Q24; etc.

Samsung Electronics will reportedly use MediaTek’s high-end application processor (AP) Dimensity 9300+ instead of Qualcomm’s Snapdragon chipsets for its new premium tablet Galaxy Tab S10 to be unveiled as early as Oct 2024. It will mark the first time for… Read more ›

7-20 #Vulnerable : Qualcomm is suing Transsion; Huawei is suing MediaTek; OPPO and Ericsson have officially entered a global strategic partnership; etc.

Intel, AMD, Samsung, LG Innotek, and SKC’s US subsidiary Absolics have all highly focused on glass substrate technology for advanced packaging. Intel stated that glass substrates could lay the foundation for achieving an astounding one trillion transistors on a single… Read more ›

7-13 #StarePinch : Google’s Tensor G4 might be the last SoC to be made by Samsung Foundry; Huawei’s triple-foldable smartphone will allegedly adopt a dual-hinge design; Huawei is t adopt under-display 3D face recognition; etc.

Google’s Tensor G4 might be the last SoC that is mass produced by Samsung Foundry, as the Tensor G5 is said to leverage TSMC’s cutting-edge 3nm process when it powers the upcoming Pixel 10 series in late 2025. Since Samsung’s… Read more ›

7-8 #PainPoints : Samsung is developing a new chip package technology; JDI has unveiled a 4K x 4K IPS LCD micro-display; EU requires every portable device to have batteries that are easy to remove and replace by consumers or independent operators by 2027; etc.

Samsung is developing a new chip package technology to prevent overheating in application processors (AP). The package attaches a heat path block, or HPB, on top of the SoC, and is expected to be used on future Exynos chips, sources… Read more ›

6-30 #Partnership : Samsung is allegedly to adopt MediaTek’s SoC on its S25 series; Apple is exploring a new technology that will make it easier for people to remove the battery; Audi is bringing ChatGPT integration to its Audi models; etc.

According to Chris Patrick, SVP and General Manager of Handsets at Qualcomm, the company has been working on making Android version updates and security updates easier for quite a while. One of the things they been working on for the… Read more ›

6-27 #SteamDeck : Huawei is reportedly building a massive semiconductor equipment R&D center in Shanghai; Apple has allegedly renewed efforts to develop AR-only glasses; Honor has showcased some of its latest AI innovations; etc.

Huawei Technologies is reportedly building a massive semiconductor equipment research and development center in Shanghai. The center’s mission includes building lithography machines, vital equipment for producing cutting-edge chips. Total investment for the the entire R&D base will come to about… Read more ›

6-22 #Cheer : Samsung has reportedly decided to invest in GPUs; Royole has been declared bankrupt; Apple has allegedly suspended work on the second-generation Vision Pro; etc.

Samsung Electronics’ semiconductor chip factory in Taylor, Texas, USA, reportedly will not be operational until 2026. The company had announced its plans to invest USD17B to set up this chip factory, but it had to invest more as construction costs… Read more ›

6-18 #WorkTogether : Samsung is to release a next-gen flagship SoC feat its own GPU in 2026; Elon Musk believes smartphone will be replaced by the Neuralink neural interface; Tata Group is allegedly to acquire a majority stake in the Indian unit of vivo; etc.

The National Institute of Advanced Industrial Science and Technology (AIST) in Japan and IBM aim to develop a quantum computer with 10,000 quantum bits (qubits), which is 75 times the capacity of current quantum computers. In quantum computing, qubits are… Read more ›