IF / News – Daily News / Weekly Summary / Regular Discussion

1-10 #NoNoNo : TSMC’s Arizona factory has reportedly picked up a second Apple product; Apple’s first foldable iPhone is allegedly to be released in 2026; Samsung Display has showcased its slidable displays; etc.

Taiwan Semiconductor Manufacturing Company (TSMC) is stepping up its efforts to expand its CoWoS (Chip on Wafer on Substrate) advanced packaging capacity with plans to double its monthly capacity to 75,000 wafers by 2025. This ambitious objective comes amid heightened… Read more ›

1-8 #TalkTalkTalk : MediaTek and Google collaborate on the design of a new 2×2 multi-radio solution; Samsung is reportedly planning to launch a dual-foldable phone in 2H25; Samsung and Apple may adopt new technologies to increase the capacity of next-gen smartphone batteries; etc.

Nvidia is leaning into robotics as it looks to expand beyond its dominant AI chip business. The company plans to launch Jetson Thor, a new compact computer designed for humanoid robots, in 1H25. Deepu Talla, Nvidia’s vice president of robotics,… Read more ›

1-1 #Happy2025 : CXMT DDR5 yield rate is expected to reach 90% by year end; OPPO will release its flagship Find series phone twice a year; vivo has announced that it will be unveiling a MR headset in 2025; etc.

TSMC’s Arizona facility is reportedly set to initiate mass production of the 4nm process by 2H25, with clients such as Apple, NVIDIA, AMD, and Qualcomm being the primary beneficiaries. TSMC’s 4nm process will be under production at the Arizona facility… Read more ›

12-28 #PostHolidayMood : UMC has no immediate plans to set up a production site in the United States; Huawei’s outward foldable smartphone project has allegedly been suspended; Foxconn has announced a partnership with Porotech to enter the AR glasses market; etc.

The US government plans to blacklist a Chinese company whose TSMC-made chip was illegally incorporated into a Huawei artificial-intelligence processor. The Chinese company, Sophgo, drew attention after a chip found on Huawei’s Ascend 910B multi-chip system matched one it ordered… Read more ›

12-20 #Compromise : Google is reportedly testing the MediaTek T900 modem in its Pixel 10 prototypes; Samsung allegedly to introduce the Qi2 wireless charging standard to S25 series; Google has announced Android XR; etc.

Apple is reportedly switching over to a new Bluetooth and Wi-Fi chip that it designed in-house starting in 2025. The combined Bluetooth and Wi-Fi chip will replace components from Broadcom, allowing Apple to reduce its reliance on the company. The… Read more ›

12-7 #Optimized : Qualcomm could increase the price of the 2025 flagship chip by a “significant” amount; Apple is betting that its upcoming in-house 5G modem; TSMC has successfully conducted a trial chip production of its 2nm N2 process with a 60% yield rate; etc.

Qualcomm could increase the price of the 2025 flagship chip by a “significant” amount. The chip has been dubbed the Snapdragon 8 Elite “Gen 2”, with the report alleging that “various internal and external factors” are the situation’s primary catalyst.… Read more ›

12-1 #Thanksgiving : Xiaomi is allegedly preparing a self-designed mobile processor; Northvolt has just filed for insolvency; Apple is actively working to build an ecosystem of Indian suppliers for components; etc.

Samsung is expected to launch Galaxy S25 series in early 2025 and the Galaxy Z Fold 7 and Galaxy Z Flip 7 in 2H25. There are also Galaxy Z Fold 7 Special Edition and a Galaxy Z Flip FE. The… Read more ›

11-24 #Sleeping : Huawei allegedly to start mass-producing its most advanced AI chip in 1Q25; TSMC is set to mass-produce its cutting-edge 2nm process by 2025; Samsung Electronics unveiled Samsung Gauss2; etc.

AMD and the Lawrence Livermore National Laboratory (LLNL) announced that the AMD-powered El Capitan has taken the top spot on the semi-annual Top500 list as the fastest-known supercomputer on the planet with 1.742 exaflops of performance. El Capitan debuts on… Read more ›

11-21 #LifeAsItIs : AMD is allegedly setting its sights on the mobile industry; Samsung’s ALoP is a future telephoto camera solution; Bose has acquired the McIntosh Group; etc.

Tim Millet, vice president of Platform Architecture (Hardware Technologies) at Apple, is clear about what differentiates the company’s silicon strategy and why it can outperform the competition continuously. Tom Boger, Vice President of Mac Product Marketing at Apple, has underlined… Read more ›

11-16 #DozeOff : Samsung could release a double-folding smartphone in 2025; Xiaomi is reportedly gearing up to enter the AI glasses market; Samsung to mass produce smart glasses in 3Q25; etc.

Samsung is allegedly considering outsourcing Exynos chip manufacturing to TSMC. Samsung Galaxy S25 series will reportedly use Qualcomm Snapdragon 8 Elite chip worldwide. Apparently, solving the low yield issues of the company’s 3nm GAA wafers will take longer than it… Read more ›

11-14 #C’estLaVie : TSMC will start producing 2nm GAA-based wafers in 4Q25; Qualcomm said the AI boom will not lead to a global chip shortage; A major smartphone company has allegedly decided to suspend its foldable product line; etc.

TSMC will start producing 2nm GAA-based wafers in 4Q25 at its Fab 20 in Hsinchu which has a capacity of 30k wpm and will be followed by the 30k wpm Fab 22 in Kaohsiung which is expected to start produxtion… Read more ›

11-11 #FearMondays : Samsung Foundry’s chip yield for the 3nm node is reportedly less than 20%; Corning is set to receive up to USD32M in funding under the CHIPS and Science Act; LGD has developed a display that can stretch from 12”-18”; etc.

According to the “Mid-Year Total Semiconductor Equipment Forecast Report” released by SEMI in Jul 2024, global wafer fab equipment spending will increase from USD95.6B in 2023 to USD98.3B in 2024, a year-on-year increase of 3%, mainly due to the gradual… Read more ›

11-9 #EcosystemMatters : Intel is aiming to ship 100M units of AI PC by 2025; Apple may use its in-house 5G modem on new iPhone SE; TSMC has made adjustments to its foundry quotations for 2025 to clients; etc.

Intel is aiming to ship 100M units of AI PC, what it calls computers powered by its AI processors, by 2025, a 150% jump from its goal by 2025 of 40M units. Intel Sales & Marketing Group Director Jack Huang… Read more ›

11-5 #LosingGame : Samsung and Apple has allegedly shown interest in acquiring Intel; Samsung will allegedly launch a Galaxy Z Flip FE in 2025; Samsung is said to be studying various ideas for changing or adding smartphone brands; etc.

Samsung and Apple has allegedly shown interest in acquiring Intel. Acquiring Intel would not only give them access to the company’s intellectual property but also its factories and related know-how. This would be especially useful for Samsung, which is struggling… Read more ›

10-28 #AgeGracefully : Arm is reportedly cancelling an architectural license agreement for Qualcomm; TSMC has informed the United States of a potential attempt by Huawei to circumvent U.S. export controls; Samsung Galaxy S26 Ultra will allegedly come equipped with 324Mp camera; etc.

Samsung has announced the Exynos 1580 processor for mid-range phones. Samsung is manufacturing the latest chipset on its third-generation 4nm EUV FinFET process. Samsung has embedded the new ARMv9 CPU cores and doubled the GPU performance. The Exynos 1580 features… Read more ›

10-19 #DamnCold : TSMC is planning more plants in Europe; Apple is setting out to conquer the smart home with an aggressive new strategy; Li Auto has become the first Chinese new energy vehicle startup to produce 1M cars; etc.

Intel is allegedly looking to sell at least a minority stake in its Altera unit in a transaction that would raise several billion dollars in cash. Intel is seeking a deal that values Altera at around USD17B. Intel purchased Altera… Read more ›