11-21 #LifeAsItIs : AMD is allegedly setting its sights on the mobile industry; Samsung’s ALoP is a future telephoto camera solution; Bose has acquired the McIntosh Group; etc.

Tim Millet, vice president of Platform Architecture (Hardware Technologies) at Apple, is clear about what differentiates the company’s silicon strategy and why it can outperform the competition continuously. Tom Boger, Vice President of Mac Product Marketing at Apple, has underlined Read more ›

11-16 #DozeOff : Samsung could release a double-folding smartphone in 2025; Xiaomi is reportedly gearing up to enter the AI glasses market; Samsung to mass produce smart glasses in 3Q25; etc.

Samsung is allegedly considering outsourcing Exynos chip manufacturing to TSMC. Samsung Galaxy S25 series will reportedly use Qualcomm Snapdragon 8 Elite chip worldwide. Apparently, solving the low yield issues of the company’s 3nm GAA wafers will take longer than it Read more ›

11-11 #FearMondays : Samsung Foundry’s chip yield for the 3nm node is reportedly less than 20%; Corning is set to receive up to USD32M in funding under the CHIPS and Science Act; LGD has developed a display that can stretch from 12”-18”; etc.

According to the “Mid-Year Total Semiconductor Equipment Forecast Report” released by SEMI in Jul 2024, global wafer fab equipment spending will increase from USD95.6B in 2023 to USD98.3B in 2024, a year-on-year increase of 3%, mainly due to the gradual Read more ›

11-5 #LosingGame : Samsung and Apple has allegedly shown interest in acquiring Intel; Samsung will allegedly launch a Galaxy Z Flip FE in 2025; Samsung is said to be studying various ideas for changing or adding smartphone brands; etc.

Samsung and Apple has allegedly shown interest in acquiring Intel. Acquiring Intel would not only give them access to the company’s intellectual property but also its factories and related know-how. This would be especially useful for Samsung, which is struggling Read more ›

10-28 #AgeGracefully : Arm is reportedly cancelling an architectural license agreement for Qualcomm; TSMC has informed the United States of a potential attempt by Huawei to circumvent U.S. export controls; Samsung Galaxy S26 Ultra will allegedly come equipped with 324Mp camera; etc.

Samsung has announced the Exynos 1580 processor for mid-range phones. Samsung  is manufacturing the latest chipset on its third-generation 4nm EUV FinFET process. Samsung has embedded the new ARMv9 CPU cores and doubled the GPU performance. The Exynos 1580 features Read more ›

10-19 #DamnCold : TSMC is planning more plants in Europe; Apple is setting out to conquer the smart home with an aggressive new strategy; Li Auto has become the first Chinese new energy vehicle startup to produce 1M cars; etc.

Intel is allegedly looking to sell at least a minority stake in its Altera unit in a transaction that would raise several billion dollars in cash. Intel is seeking a deal that values Altera at around USD17B. Intel purchased Altera Read more ›

10-12 #AfterHoliday : Qualcomm has confirmed that hackers exploited a zero-day; Samsung reportedly expects to ship about 22M units of the Galaxy S25 lineup by 1H25; Samsung may start charging for certain Galaxy AI features in 2025; etc.

GWM has officially announced the successful development and activation of its RISC-V automotive-grade MCU chip, the Zijing M100, which was jointly developed with multiple partners. It features a modular architecture with a reconfigurable core and a four-stage pipeline design that Read more ›

9-29 #HappyNationalDay : Google has allegedly plans to keep TSMC as a long-term partner; Samsung Display has announced a USD1.8B investment to build an OLED display factory in Vietnam; Apple has reportedly delayed the deployment of under-display Face ID technology; etc.

Google has allegedly plans to keep TSMC as a long-term partner, with its Tensor G6 supposedly leveraging the advanced 2nm process. The Tensor G5 was previously reported in July of this year to have reached ‘tape-out’ status, with all that Read more ›

9-23 #Thankful : Qualcomm has allegedly approached Intel to explore a potential acquisition; Apple is poised to equip iPhones with its self-developed 5G modem by 2025; TCL has announced new strategic partnership with Microsoft for AI; etc.

Unisoc has announced the successful upgrade of its 5G and 4G mobile platforms to Android 15. This update covers platforms such as the T820, T770, T765, T760, T750 for 5G, and T620, T619, T616, T615, T612, and T606 for 4G. Read more ›

9-18 #MidAutumn : Samsung is allegedly cutting up to 30% of its overseas staff at some divisions; India‘ CCI revealed Amazon and Flipkart’s antitrust issue; Google and Apple have been slapped with astronomical fines in the EU; etc.

Qualcomm has allegedly explored the possibility of acquiring portions of Intel’s design business to boost the company’s product portfolio. Qualcomm  has examined acquiring different pieces of Intel, which is struggling to generate cash and looking to shed business units and Read more ›

8-27 #AntiSocial : Xiaomi is allegedly developing a tri-foldable phone; Samsung has confirmed that it is working on a “double-foldable” phone; OnePlus, OPPO, and realme have allegedly started developing an ecosystem of phone accessories with magnets; etc.

Huawei was first included in the United States’ export control list in 2019, but several companies including Qualcomm were allowed to export certain 4G chips to it after obtaining exemptions from Washington. Before being blacklisted from trade, Huawei had been Read more ›

8-3 #Run : Apple’s both foldable devices will allegedly be coming in 2026; Meizu wants to launch its first electric car within 2024; The EU’s AI law officially enters into force on 1 Aug 2024; etc.

Applied Materials was rejected for funding under the CHIPS act for a research and development center in Silicon Valley. Commerce Department officials allegedly rejected the chipmaking equipment maker’s bid to gain U.S. funding for a USD4B facility in Sunnyvale, California. Read more ›