September 2016 – IF / News

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9-28: Lenovo to lay off 1000 Moto employees; BlackBerry to stop developing hardware smartphone; Qualcomm Snapdragon 410E / 600E announced; etc.

Chipset Qualcomm Snapdragon 410E and the 600E are announced targeting IoT application, with the former clocked at 1.2GHz with an Adreno 306 GPU, while the latter is clocked at 1.5GHz with an Adreno 320 GPU. Qualcomm is also teaming with… Read more ›

9-26: MediaTek officially unveils Helio X30, P25 and P20; 70% of current owners consider buying a more expensive model for their next phone; etc.

Chipset TSMC Research Unit has revealed the roadmap of the company for the next few years. TSMC will be switching to 10nm process technology by the end of 2016 and will start 7nm trial production in 2017.The 16 FFC process… Read more ›

9-23 Week: 1-Oct long holiday is coming, and this week summary comes with MediaTek 4G/3G shortage, Huawei Leica collaboration, EDO investing in G6 OLED; etc.

10/1 long holiday is impending, and before that let’s take a look at this week summary: Headlines: MediaTek 4G chipsets will be in tight supply till 2017, MediaTek 3G chipsets have a huge gap in Aug / Sept 2016, and… Read more ›

9-25: Huawei and Leica have created a new R&D center in Germany; Huawei will start to manufacture smartphones in India in partnership with Flex; etc.

Chipset Spreadtrum announced that its WCDMA//HSPA(+) chipsets SC7731C and SC7731G have been adopted by Burmese leading mobile operator Myanmar Posts and Telecommunications (MPT) for its latest flagship smartphone models M40 and M50, which have been launched into the market. (EE… Read more ›

9-23: Sorry for absent yesterday. MediaTek entering Samsung supply chain; Rumored Blackberry to close its smartphone hardware business; Rumored Smartisan to be acquired by Xiaomi; etc.

Chipset Chung Seung-eun, senior vice president and chief of Samsung’s semiconductor research and development center, visited ASLM’s headquarters to finalize the deal purchasing new chip-making systems, called extreme ultraviolet lithography, which is worth about KRW200 billion (USD178.41 million). (TechNews, XDA… Read more ›

9-21: The BOM cost for a 32GB NAND Apple iPhone 7 USD219.80; Japan government would consider divesting its stake in Japan Display; etc.

Touch Display Japan’s industry minister Hiroshige Seko said the government would consider divesting its stake in Japan Display unless the company can demonstrate it is more than just a commodity supplier to Apple. (CN Beta, TechNews, WSJ, Apple Insider) Memory… Read more ›

9-20: MediaTek 4G chipsets reportedly will be in tight supply till 2017; In 2016 Spreadtrum’s 3G share is believed to exceed MediaTek in the market; etc.

Chipset ARM announces Cortex-R52, the company’s first implementation of ARMv8-R aiming for IoT and autonomous automotive applications. The Cortex-R52 offers a 35% performance uplift compared to the Cortex-R5. (CN Beta, 91, My Drivers, AnandTech, article, Venture Beat) Venkata Renduchintala, president… Read more ›

9-19: MediaTek is considering launching Helio X35; Samsung is looking to invest heavily in its OLED business, which will squeeze capex on foundry; etc.

Chipset To expand its coverage of products, after launching its Helio X30 using TSMC’s 10nm process, which will enter mass production end of 2016 / beginning of 2017, MediaTek is considering to launch Helio X35. (HC360, Woyoo, ETime, Sohu) According… Read more ›

9-18: Indian manufacture slow and cycle is long, and tax is a huge factor; Xiaomi Mi4 is found out having a “backdoor”; etc.

Chipset According to a teardown of Apple iPhone 7 by Chipworks, A10 Fusion processor part number is APL1W24,339S00255. A10 is thin thanks to TSMC’s InFO packaging technology. Intel has four components: the baseband LTE modem, two transceivers and a power… Read more ›

9-16 Week: Happy Mid-Autumn, and this week we have Qualcomm SD653, Samsung Exynos 8895, Samsung invests in CSOT 11G fab, etc.

Happy Mid-Autumn Festival, and wish everyone a happy family. This week summary: Headlines: Qualcomm Snapdragon 653 (MSM8976Pro) chipset information is leaked Qualcomm has announced the opening of Qualcomm Communication Technologies (Shanghai) in Shanghai Qualcomm introduces new Clear Sight dual camera… Read more ›

9-16: Samsung Electronics has sold all its shares in Sharp; Blackcow Food raises CNY18 billion that will be invested in OLED R&D and production; etc.

Chipset Globalfoundries (GF) has announced plans for a 7nm FinFET process that can deliver chips with up to 30% more performance or 60% less power consumption than its current 14nm node. The process will be in production in late 2018.… Read more ›

9-15 Happy Mid-Autumn Festival: Apple announced that the first batch of iPhone 7 Plus has sold out globally; Qualcomm introduces new Clear Sight dual camera system; etc.

Chipset Samsung Exynos 8895 leaks – to reach frequencies of 3.0GHz and power consumption lower than 5W. (Phone Arena, WCCF Tech, ZOL, My Drivers) Chip orders for Apple iPhone 7 placed thus far for 2016 are higher than previously estimated,… Read more ›

2016-09-15 1 Comment

9-14: India urges tech giants to integrate biometric technology of Aadhaar program into their products; Alibaba’s payments arm, Ant Financial, has acquired EyeVerify; etc.

Chipset NVIDIA revealed a new configuration of its DRIVE PX 2 in-car autonomous driving computing platform. The new single-core configuration will be used by Baidu in its own self-driving cars. It makes it possible to process visual and sensor data… Read more ›

9-13: Samsung Display to invest CNY210mln in CSOT’s G11 fab; South Korea’s earthquake do not impact much on semiconductor / panel makers; etc.

Chipset NVIDIA’s new Tesla P4 and P40 GPUs are targeted at deep learning. The P40 has 3,840 CUDA cores, offers 12 teraflops of single-precision performance, has 24GB of GDDR5 memory and draws 250W of power. The P4 has 2,560 cores,… Read more ›

Smartphone ASPs are declining generally, but some Chinese vendors ASP show some obvious increase

Smartphone ASP is generally declining—at 2Q16 ASP has dropped 7.8% compared to 1Q16. Apple ASP stays within USD600~700, but at 2Q16 it is believed because of iPhone SE, its ASP has dropped 9.1% compared to last year. Samsung ASP always… Read more ›

9-10: China-based smartphone vendors have become more conservative about placing orders for parts and components 4Q16; Xiaomi, Lenovo, OPPO, vivo have occupied 18.3% market share of Tier 2&3 cities; etc.

Chipset Qualcomm Snapdragon 653 (MSM8976Pro) chipset information is leaked. It will be manufactured using the 28nm process, featuring octa-core—4×Cortex A73+4×Cortex A53. (Gizmo China, CN Beta) Taking advantage of technology developed to manipulate light on chips, a team based in Spain and… Read more ›