IF / News

Chinese chip company Loongson Technology has unveiled its latest self-developed central processing unit (CPU) 3A6000, which can be used in multiple applications across different platforms. It has 4 physical cores / 8 logic cores, main frequency 2.0-2.5GHz. Loongson 3A6000 adopts… Read more ›

MediaTek has announced Dimensity 8300, which is fabed on TSMC’s second-generation 4nm process. Dimensity 8300 features 4x Arm Cortex-A715 performance cores clocked at up to 3.35GHz alongside 4x Arm Cortex-A510 efficiency units at up to 2.2GHz clock speeds. All eight… Read more ›

Apple has fallen further behind in its multibillion-dollar effort to make a modem chip for the iPhone, stymied by the complexity of replacing an intricate Qualcomm component. After already delaying a plan to have an in-house chip ready by 2024,… Read more ›

In response to the global shortage of GPUs, Fujitsu has developed “Adaptive GPU Allocator Technology”, a technology that can automatically switch between CPU and GPU computing resources in real time even during program processing. This technology can allocate GPUs in… Read more ›

Apple’s A17 processor was the first chip to use TSMC’s N3 (3nm-class) process technology, the company has expanded its N3 lineup with a family of PC-oriented M3 chips for desktop and laptop computers. Analyst Jay Goldberg from Digits to Dollars… Read more ›

Samsung Electronics has allegedly received an order for Google’s upcoming Tensor G4 SoC, which will make its way to the Pixel 9 series. The Tensor G4 will feature an improved CPU from the G3. It bears an internal project codename… Read more ›