IF / News

Qualcomm has announced its latest next-generation modem for smartphones, Qualcomm Snapdragon X70 5G. The Snapdragon X70 can offer up to 10Gbps downlink speed and a peak 3.5Gbps upload speed, ensuring maximum performance. It has an AI-based channel-state feedback and optimization algorithm to increase the average downlink and uplink speeds. The Qualcomm Snapdragon X70 has support for global 5G multi-SIM and Dual-SIM Dual Active. The company claims that it is up to 60% more power-efficient, thanks to Qualcomm 5G PowerSave Gen 3 technology. Qualcomm’s QET7100 Wideband Envelope Tracking and AI-based adaptive antenna tuning will also help in power conservation along with optimizing performance and latency. The company has revealed that the Snapdragon X70 modem is expected to launch in 5G devices by the end of 2022.(Android Authority, Android Central, Qualcomm, Gizmo China, WCCFTech)

Qualcomm launches the new Snapdragon Connect badge for mobile devices. Snapdragon Connect includes a suite of Qualcomm’s best connectivity technologies for OEMs to implement in their devices. Snapdragon Connect also extends to other devices, including Snapdragon-powered laptops running some of the latest Qualcomm chipsets, as well as gaming devices, AR/VR for Metaverse-ready headsets, and automotive, with their own set of requirements for the badge. Qualcomm says its unique integrated approach to the platform ensures not only better connectivity across devices but improved efficiency for better battery life.(Android Central, Qualcomm, UDN)

Qualcomm has announced FastConnect 7800 mobile connectivity subsystem, which is intended to bring advanced Wi-Fi technologies and next-generation Dual Bluetooth audio to power a new era of immersive experiences. Qualcomm’s WiFi 7 implementation leverages High Band Simultaneous Multi-Link technology that can use two WiFi radios at once for four streams of connectivity in the 5 GHz and 6 GHz bands, potentially bringing faster speeds and reduced congestion (thanks to 320 MHz of bandwidth in the 6 GHz spectrum and 240MHz in the 5 GHz band). FastConnect 7800 also includes includes two Bluetooth radios and support for Bluetooth 5.3.(Liliputing, Qualcomm, Qualcomm, Hot Hardware, CNX-Software)

Qualcomm has announced two new audio platforms that support its Snapdragon Sound technology. The S5 (QCC517x) and S3 (QCC307x) sound platforms include 16-bit lossless CD-quality audio, stereo recording via earbuds and multipoint Bluetooth wireless connectivity. The company is promising that the chips can deliver: Lossless CD-quality 16-bit / 44.1 kHz audio over Bluetooth; “High resolution” 24-bit / 96 kHz audio over Bluetooth; 32 kHz super wideband voice call quality Stereo audio recording using earbuds; Gaming mode with 68ms latency (25% lower than previous-gen); and 20% reduction in power consumption. Qualcomm says to expect the first device featuring the new Snapdragon Sound technology to arrive in 2H22.(Android Central, Liliputing, Gizmo China)

Diodes has announced it has entered into a definitive agreement to acquire ON Semiconductor (onsemi) wafer fabrication facility and operations located in South Portland, Maine. The South Portland Facility or SPFAB offers Diodes additional 200mm wafer fab capacity for analog products to accelerate its growth initiatives in the automotive and industrial end markets. In addition, the company noted that this US-based facility, together with Diodes’ existing wafer fabrication facilities in Asia and Europe, will further enhance Diodes’ global manufacturing operations.(Laoyaoba, Yahoo, Diodes, NADSAQ)

Dr. Yuh-Jier Mii, deputy general manager of research and development at TSMC, has said that the shortage of the semiconductor industry will take 2-3 years to be resolved after a new fab joins production. Compared with 2 years ago, the future demand is now clearly grasped by many. He has contributed a lot to the development and manufacture of advanced complementary metal oxide semiconductor (CMOS) technology, successfully developed 90nm, 40nm and 28nm technologies, and then led the team to develop 16nm, 7nm, 5nm, 3nm and other more advanced process technologies. He believes that one of the most important challenges is to identify options for each technology that will bring the most value to TSMC customers and provide solutions within a predictable time frame, noting that the upcoming 3nm will be available at 5nm 2 and a half years later, the process technology will be succeeded, that is, it will come out in 2022, and 2nm technology development is also underway at the same time. (CN Beta, UDN, IEEE)

TCL has showcased a number of flexible display concepts: 1) Ultra Flex display concept folds up to 360°, which means it can fold inward and outward; 2) Surround Display concept only folds in one direction, but it also eliminates the need for a secondary cover display because the primary screen wraps around the phone, covering nearly half of the back cover; 3) Fold ‘n’ Roll concept is a display that not only bends at the middle.(Liliputing, Engadget, Android Authority)

According to Sigmaintell, the global shipments of foldable smartphones in 2021 will be about 7.21M units, a YoY increase of about 171.9%. The maturity of technology and the decline in prices drive the market for foldable smartphones to continue to heat up. With the further maturity of devices, phone manufacturers have also begun to pre-research various forms of smartphones. Sigmaintell estimates that the global shipments of foldable smartphones will reach about 14.4M units in 2022, a YoY increase of about 99.6%, and are expected to exceed 70M units in 2025. More manufacturers will use the trend of folding screens to enhance their brand image and base themselves on the high-end market. (Sigmaintell, press, CN Beta)

Tecno has revealed that the cameras on future Tecno phones in 2022 will be powered by a self-developed RGBW sub-pixel rendering algorithm that increases the light captured by the CMOS sensor by 60%. Light intake will be further enhanced by 30% thanks to the G+P (glass + plastic) lens technology, resulting in an overall 200% increase and bringing a revolutionary low-light imaging experience to consumers. Tecno also plans to release its Sensor Shift technology in 2022, making itself the first mobile phone brand in Android system to do so. Sensor Shift is an image stabilization technology that uses sensor movements instead of lens movements to compensate for vibrations.(GSM Arena, Tecno Mobile)

OPPO has announced 240W charging technology, dubbed 240W SuperVOOC Flash Charge. OPPO claims that the tech can charge a 4,500mAh battery in just 9 minutes, adding that the battery will reach 50% capacity in 3.5 minutes. OPPO has also showcased the upcoming 150W SuperVOOC system, charging a prototype phone with a 4,500 mAh battery from 1% to 50% in just 5 minutes and got all the way to 100% in a total of 15 minutes (this was with the device powered on, but inactive and in airplane mode). For comparison, the 65W charger needs around 40 minutes to get to 100%. The new system introduces a 150W SuperVOOC charger.(Android Authority, Twitter, GSM Arena)

realme has announced the next evolution of its Dart charging system dubbed UltraDart. It is a new charging architecture that will enable speeds ranging from 100W to 200W. The company also revealed that it will soon launch the first smartphone to utilize the UltraDart Charging Architecture (UDCA), the Realme GT Neo3, which will be right in the middle of the range with 150W.(GSM Arena, Android Headlines, Pocket Now)

Panasonic aims to start mass production of a higher-capacity battery for Tesla by Mar 2024. The company is building a production facility for the battery at its Wakayama Factory, where it will create two more production lines and make structural improvements. Development is continuing on the 4,680 lithium-ion battery. Panasonic has planned to invest JPY80B (USD692M) in the plant.(Engadget, TechCrunch, Reuters, Electrek)

The head of Samsung Electronics Mobile Experience TM Roh has announced that the Galaxy Note series will now come out as Galaxy S Ultra from now on. This means that Samsung is not planning on releasing another Note and the S Ultra will be the device to carry the legacy forward. (CN Beta, Review Geek, Sam Mobile, WCCFTech, Twitter)

TCL 30 series is announced:

• TCL 30 E – 6.52” 720×1600 HD+ v-notch, MediaTek Helio G25, rear dual 50MP-2MP depth + front 5MP, 3+64GB, Android 12.0, rear fingerprint, 5000mAh 10W, from EUR139.
• TCL 30 – 6.7” 1080×2400 FHD+ u-notch AMOLED, MediaTek Helio G37, rear tri 50MP-2MP macro-2MP depth + front 8MP, 4+64GB, Android 12.0, side fingerprint, 5010mAh 18W, from EUR179.
• TCL 30 5G – 6.7” 1080×2400 FHD+ u-notch AMOLED, MediaTek Dimensity 700 5G, rear tri 50MP-2MP macro-2MP depth + front 8MP, 4+64 / 4+128GB, Android 12.0, side fingerprint, 5000mAh 18W, from EUR249.
• TCL 30+ – 6.7” 1080×2400 FHD+ u-notch AMOLED, MediaTek Helio G37, rear tri 50MP-2MP macro-2MP depth + front 13MP, 4+128GB, Android 12.0, side fingerprint, 5000mAh 18W, from EUR199.
• TCL 30 SE – 6.52” 720×1600 HD+ v-notch, MediaTek Helio G25, rear tri 50MP-2MP macro-2MP depth + front 8MP, 4+64 / 4+128GB, Android 12.0, rear fingerprint, 5000mAh 15W, from EUR149. (Android Central, Digital Trends, GSM Arena, Android Headlines)

POCO X4 Pro 5G and M4 Pro (4G) are announced:

• X4 Pro 5G – 6.67” 1080×2400 FHD+ HiD AMOLED 102Hz, Qualcomm Snapdragon 695 5G, rear tri 108MP-8MP ultrawide-2MP macro +front 16MP, 6+128 / 8+256GB, Android 11.0, side fingerprint, stereo speakers, 5000mAh 67W, EUR299 / EUR349.
• M4 Pro (4G) – 6.43” 1080×2400 FHD+ HiD AMOLED 90Hz, MediaTek Helio G96, rear tri 64MP-8MP ultrawide-2MP macro + front 16MP, 6+128 / 8+256GB, Android 11.0, side fingerprint, stereo speakers, 5000mAh 33W, EUR219 / EUR269. (Android Authority, GSM Arena)

HMD Global has announced 3 new Nokia smartphones with Android 11.0 Go:

• C21 Plus – 6.52” 720×1600 HD+ v-notch, Unisoc SC9863A, rear dual 13MP-2MP depth + front 5MP, 2+32 / 3+32 / 3+64 / 4+64GB, Android 11.0 Go, rear fingerprint, 4000mAh / 5000mAh, price to be announced.
• C21 – 6.52” 720×1600 HD+ v-notch, Unisoc SC9863A, rear 8MP + front 5MP, 2+32 / 3+32 / 3+64GB, Android 11.0 Go, rear fingerprint, 3000mAh, price to be announced.
• C2 2nd edition – 5.7” 480×960 qHD+ 18:9, Unisoc quad-core, rear 5MP + front 2MP, 1+32 / 2+32GB, Android 11.0 Go, no fingerprint, 2400mAh, price to be announced. (Android Central, GSM Arena, GSM Arena)

Huawei has announced the Super Device software package that will allow Huawei devices to connect seamlessly. The Super Device software package marks a smooth transition in the development of synergy in communications between laptops, smartphones, smartwatches, fitness bands, and the array of smart home devices. This also includes connectivity to the Huawei Smart Office which enables cross-device collaboration whether it is running on Huawei’s Harmony OS or the Windows operating system. The new Super Device software brings the array of functionality available within the Huawei ecosystem into a single interface and it is bound to enhance the appeal and overall user experience using Huawei’s devices.(GSM Arena, Huawei, Design Taxi, Global Times, Gizmo China, PRNAsia, IT Home, CN Beta)

TCL has unveiled a series of tablets:

• NXTPAPER MAX 10 – 10.36” 1200×1900 FHD+ NXTPAPER LCD, MediaTek MT8786, rear 8MP + front 5MP, 4+64GB, Android 11.0, 8000mAh LiPo, supports stylus pen, Wi-Fi only / LTE versions, from EUR269.
• Tab 10s 5G – 10.1” 1920×1200 FHD+ IPS LCD, Mediatek MT8771, rear 8MP + front 5MP, 4+64GB, Android 12.0, 8000mAh 18W, EUR349.
• Tab 10 FHD 4G – 10.1” 1200×1900 FHD+ IPS LCD, MediaTek MT8768E, rear 5MP + front 5MP, 3+64GB, Android 11.0 (including TCL Kids feature), 5500mAh 10W, EUR199.
• Tab 10 HD – 10.1” 1280×800 IPS LCD, MediaTek octa-core, rear 5MP + front 5MP, 2+32GB, Android 11.0, 5500mAh EUR179. (Android Central, GSM Arena, ZDNet)

Huawei MatePad Paper is announced – 10.3” 1872×1404 E-Ink display with smart refresh technology, 4+64GB, HarmonyOS 2.0, supports M-Pencil (2nd generation), fingerprint power button, dual speakers, 3625mAh 22.5W, EUR499. (Pocket Lint, Gizmo China, GSM Arena, Huawei)

Samsung Electronics will reportedly introduce an augmented reality (AR) device that will be loaded with hologram technology. The company has been preparing to commercialize hologram technology for a long time. Samsung’s AR device will run on the company’s own Exynos application processor (AP) and the Google Android OS. The company is developing technologies in close cooperation with DigiLens, a U.S. company specializing in AR and Extended Reality (XR). Samsung Electronics has completed the development of a prototype and is reportedly adjusting the release time. The Korean tech giant is also developing an AR headset by partnering with Microsoft. A task force (TF) was formed for this project. (Laoyaoba, OnMSFT, ET News, Business Korea)

Whole Foods Market has announced the opening of its first-ever store touting Amazon’s Just Walk Out technology in Washington D.C. The technology from Whole Foods allows shoppers to skip waiting in line for the cash register altogether, although there will also be a self-checkout option for customers as well. The “Just Walk Out” service requires shoppers to scan in with an in-store code at the store’s entry gate. Customers are expected to bag their own groceries as they shop. In-store sensors track these selections and the total cost of the basket. Then shoppers scan out of the store and receive an emailed receipt. Shoppers who wish to opt out of the service can access the store through a gate labeled “pay at register,” which allows them to pay via self-checkout.(The Verge, Business Insider, Whole Foods Market)