6-11: Intel to supply modem to Apple for next-gen iPhone; Samsung says bendable phones is right at the corner; Huawei is determined to be top 1 by 2021; etc.
Intel will reportedly replace Qualcomm as the supplier of modem hardware for some models in the next generation of iPhones; Samsung more or less confirmed that the company had bendable phones in the works, and that they are “right around the corner”; A surge in connected personal devices around the world will mean that by 2020 there will be 26 billion connected devices across the world; Bluetooth 5.0 is set to announce on June 16; Huawei is determine to become the top smartphone producer globally by 2021; etc.
Chipset |
Intel will reportedly replace Qualcomm as the supplier of modem hardware for some models in the next generation of iPhones. (CN Beta, Engadget, Bloomberg) |
Touch Display |
Samsung Electronic president and CEO of North America Gregory Lee more or less confirmed that the company had bendable phones in the works, and that they are “right around the corner”. (Ubergizmo, Re/Code, Pocket Now, CN Beta) |
Sensors |
Philips showcasing “contactless monitoring” system that was able to show person’s pulse and breathing rate without anything touching the person’s body. All the monitoring is done with a camera, which feeds images to a computer running Philips’ proprietary software. (Engadget, Philips, CNET) |
Connectivity |
Cisco estimated that by 2020, there will be 4.1 billion internet users, up from the current figure of around 3 billion in 2016, signifying 52% of the world’s population. A surge in connected personal devices around the world will mean that by 2020 there will be 26 billion connected devices across the world, up from 16 billion connections in 2015, according to research conducted by Cisco. (Cisco, infographic, CN Beta, Tech Week Europe) |
Bluetooth 5.0, the latest version of the ubiquitous wireless standard, is set to be announced on June 16, according to an e-mail sent by Bluetooth SIG Executive Director Mark Powell. This update promises to double the range and quadruple the speed of Bluetooth 4.2. (CN Beta, TechRadar, Ars Technica) |
Smartphones |
According to IC Insights, China-based smartphone suppliers represented 8 of the top 12 slots for smartphone IC suppliers in 1Q16. Chinese companies Huawei, OPPO and Xiaomi were all in the top 5 suppliers. (EE Times, IC Insights, press) |
Huawei chairman Richard Yu comments that the company is determine to become the top smartphone producer globally by 2021. (GSM Arena, WSJ, Phone Arena, 10JQKA) |
Meitu M6 is official – 5” FHD AMOLED display, MediaTek P10 processor, 21MP + 21MP cameras, 3GB RAM, 64GB ROM, Android 6.0 (MEIOS3), LTE, Hi-Fi chipset, fingerprint sensor, 2900mAh battery. (Phone Arena, Gizmo China, 163, ZOL) |
Meitu V4s is official – 5” FHD AMOLED display, MediaTek Helio P10 processor, 21MP + 21MP cameras, 3GB RAM, 128GB ROM, Android 6.0 (MEIOS3), LTE, Hi-Fi chipset, fingerprint sensor, 2650mAh battery. (Phone Arena, Gizmo China, 163, ZOL) |
Wearables |
Wearable fitness and smart garment technology firm Sensoria is developing a line of smart sports bras and T-shirts that monitor heart rate via washable electrodes embedded in the fabric that connect to a new version of its Fitness v2.0 app. (Android Headlines, Globe Newswire, Just Style) |
Internet of Things |
According to IHS, Apple TV managed to ship in the region of 1.7 million units during 1Q16. While, in contrast, Google Chromecast eclipsed that figure with as many as 3.2 million units being shipped during the same period. (Android Headlines, IHS, press, CN Beta) |