09-11: HTC indicates “full display technology” is not difficult, and the company will continue to focus on mid-to-high products; etc.
Chipsets
Semiconductor foundry is meeting “super lifecycle” effect. Its cost is increasing since 2017, and in 4Q17 12” has reached USD80, and in 1Q18 it expects to reach USD100, 25% up on quarter; and there would be 10% shortage. Moreover, the market has rumor saying the foundry vendors demand their customers to pay deposit before fixing the costs. (China Times, CTEE, Laoyaoba)
TSMC Nanjing 12” plant has begun installing equipments, so that TSMC also grab “Made in China” business opportunities. However, TSMC still focuses in Taiwan. The 12” scale has nearly 100M units, which is 50 times of the mainland. Taiwan’s future is to help solve 3nm required water, electricity, land and environmental assessment, the 3nm investment amount to NTD500B, which stays in Taiwan. The initial plan of TSMC monthly volume is 20K units, which could cover the demand of HiSilicon and MediaTek. (Laoyaoba, UDN, China Times)
Samsung has confirmed that 11nm FinFET process technology is added to its foundry process portfolio. The 11LLP (low power plus) offers 15% better performance and is 10% smaller in size with same power consumption when compared to a chip based on 14nm. The premium phones of 2018 will be using the new 7nm LPP chips built with Extrem Ultra Violet (EUV) litography. Those chips will come out in 2H18. (CN Beta, Samsung, GSM Arena, Sammy Hub)
Touch Display
HTC global operation and technology leader Chen Wenjun indicates that full display technology for the company is like “instant noodle”, it is not difficult. HTC is putting more focus on how to make full display user interaction better, and will have product soon. (CN Beta, Sohu, 163)
Due to LCD driver IC shipment is increasing, FocalTech’s TDDI specs compliant IDC chipset shipment is growing. In Aug 2017 its consolidated revenue has reached CNY1.156B. FocalTech’s IDC has been demanded by BOE, Tianma and other panel makers, and have succeeded entering Huawei, Xiaomi, Sony and other smartphone vendors’ supply chain. (China Times, EE World, Laoyaoba)
Sensory
TrendForce anticipates that from 2017 onward, the market for 3D sensing solutions used in mobile devices will witness leaping growth. The total value of the global market for 3D sensing modules used in mobile devices is estimated to reach USD1.5B in 2017 and is forecast to grow at a massive CAGR of 209% to around USD14B in 2020. Note that the 3D sensing module that is being discussed includes IR transmitter and receiver components. (TechNews, TrendForce[cn], press, TrendForce, press)
Smartphones
HTC global operation leader Chen Wenjun reveals that HTC will continue to focus on mid-to-high end products, and by end of 2017 the company will have mid-range products and in 1Q18 will have new products. (CN Beta, Sina, 163)
Meizu VP Li Nan reveals that the Blue Charm series will fall into 4 main categories: X, flagship series; E, targets youth and business class, priced over CNY1000; Note, the main line of the company, priced at about CNY1000; and base series, covers other Meizu phones such as U and non-Note M series. (GizChina, Gizmo China, My Drivers)
Huawei and Dassault Systèmes have signed cooperation Memorandum of Understanding (MoU), and announced that the two companies are working closely to enable Dassault Systèmes’ 3DEXPERIENCE platform to run on Huawei Cloud. (Digitimes, Economic Times, Huawei, Huawei)
Xiaomi Mi Mix 2 is official – 5.99” FHD+ 2160×1080 IPS LCD display, Qualcomm Snapdragon 835 processor, 12MP f/2.0 1.25µm OIS + 5MP cameras, 6 / 8GB RAM, 64 / 128 / 256GB storage, USB C, rear fingerprint scanner, 3400mAh battery, from CNY3299. (Android Authority, Android Central, Android Headlines, CN Beta, GizChina)
Xiaomi Mi Note 3 is official in China – 5.5” FHD Super AMOLED display, Qualcomm Snapdragon 660 processor, rear dual 12MP -12MP 2x telephoto PDAF + front 16MP 2µm cameras, 6GB RAM, 64 / 128GB storage, facial recognition, front fingerprint scanner, 3500mAh battery, from CNY2499. (Android Headlines, CN Beta, GizChina, Gizmo China)
Wearables
Xiaomi lab market director Li Qi announces that Xiaomi will collaborate with Facebook’s subsidy Oculus to launch an all-in-one VR device. He also promised that Xiaomi will continue to invest 3~5 years in VR. (CN Beta, JRJ)
Internet of Things
According to Xin Guobin, the vice minister of industry and information technology, China will set a deadline for automakers to end sales of fossil-fuel-powered vehicles, becoming the biggest market to do so in a move that will accelerate the push into the electric car market led by companies including BYD Co. and BAIC Motor Corp. (Ubergizmo, Bloomberg, VOA Chinese, Reuters, Xinhuanet)
Gartner’s Hype Cycle provides a high-level view of important emerging trends that organizations must track, as well as the specific technologies that must be monitored. In 2017, 3 trends stand out at a high level: AI Everywhere, Transparently Immersive Experiences and Digital Platforms. Enterprise architects who are focused on technology innovation must evaluate these high-level trends and the featured technologies, as well as the potential impact (value and risk) on their businesses. These trends also provide a significant opportunity for EA leaders to help senior business and IT leaders respond to the digital business opportunities and threats by creating signature-ready actionable and diagnostic deliverables that guide investment decisions. (CN Beta, Gartner, report)
China has the resources and ambitious top-down plans to potentially create an intelligent economy powered by artificial intelligence and machine learning over the next several years, according to Goldman Sachs. Goldman identified four key areas where development is needed to create value in AI: talent, data, infrastructure and computing power. Goldman has concluded China has the talent, data and infrastructure needed to fully embrace AI. (CNBC, Value Walk, RFID World, Futurism, SEMI, Wall Street 1, Wall Street 2, report part 1, part 2)
