Monthly Archives: July 2024

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7-28 #CaughtCold : MediaTek has filed a lawsuit against Huawei; Apple’s foldable concept allegedly “has moved beyond the conceptual stage”; Huawei’s tri-fold phone is expected to be released in 4Q24; etc.

Samsung Electronics will reportedly use MediaTek’s high-end application processor (AP) Dimensity 9300+ instead of Qualcomm’s Snapdragon chipsets for its new premium tablet Galaxy Tab S10 to be unveiled as early as Oct 2024. It will mark the first time for… Read more ›

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7-13 #StarePinch : Google’s Tensor G4 might be the last SoC to be made by Samsung Foundry; Huawei’s triple-foldable smartphone will allegedly adopt a dual-hinge design; Huawei is t adopt under-display 3D face recognition; etc.

Google’s Tensor G4 might be the last SoC that is mass produced by Samsung Foundry, as the Tensor G5 is said to leverage TSMC’s cutting-edge 3nm process when it powers the upcoming Pixel 10 series in late 2025. Since Samsung’s… Read more ›

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7-8 #PainPoints : Samsung is developing a new chip package technology; JDI has unveiled a 4K x 4K IPS LCD micro-display; EU requires every portable device to have batteries that are easy to remove and replace by consumers or independent operators by 2027; etc.

Samsung is developing a new chip package technology to prevent overheating in application processors (AP). The package attaches a heat path block, or HPB, on top of the SoC, and is expected to be used on future Exynos chips, sources… Read more ›

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