IF / News

Samsung Electronics will reportedly use MediaTek’s high-end application processor (AP) Dimensity 9300+ instead of Qualcomm’s Snapdragon chipsets for its new premium tablet Galaxy Tab S10 to be unveiled as early as Oct 2024. It will mark the first time for Samsung to power Galaxy Tab series with MediaTek’s processors, a move viewed as Samsung’s strategy to leverage its cooperation with MediaTek to gain the upper hand in price negotiations with Qualcomm. Until now, Samsung’s premium tablet computers have mainly been fitted with Qualcomm’s Snapdragon, which combines the central and graphic processing units.  The predecessors of the upcoming Galaxy Tab S10 were powered by Snapdragon chips, Galaxy Tab S8, released in 2022, was equipped with Snapdragon 8 Gen 1. The Galaxy Tab S9, launched in 2023, was embedded with Snapdragon 8 Gen 2. MediaTek sells about 100M units of chipsets every quarter and outsources its premium chipset production, mainly to TSMC.(Android Headlines, KED Global)

MediaTek and its subsidiaries HFI Innovation and MTK Wireless have filed a lawsuit against Huawei Technologies before the High Court of Justice for England and Wales. Huawei is reportedly pursuing a licensing approach that deviates from the standard licensing approach for cellular Standard Essential Patents (SEPs). Traditionally, SEP licensing focuses on end products like smartphones. However, Huawei appears to be pursuing a component-level licensing strategy, targeting chipsets directly. (Gizmo China, EET-China, My Drivers)

MediaTek has launched Made in India smart digital cluster and smart module in collaboration with Jio Platforms Limited’s (JPL) subsidiary, JioThings, for the two-wheelers (2W) as they seek to serve the fast-growing demand for electronics in this segment of the automobile industry. JioThings is a provider of end-to-end Internet of Things (IoT) solutions. This collaboration brings together MediaTek’s chipset technology and JioThings’ digital solutions to strengthen its presence in the two-wheeler and electric vehicle (EV) sectors. The companies, citing third-party estimates, said in a joint media statement that the Indian 2W EV market projected to reach INR10,000 crores by end of 2025 with more than 3 million vehicles on road, growing at a CAGR of 50% over next 5 years. (TechCrunch, India Times, ET Telecom)

Applied Materials has revealed chip wiring innovations that will help address challenges in the way of energy-efficient computing. The use of new materials in chip wiring will enable 2nm node manufacturing, where the width between circuits is around 2B of a meter apart. These innovations will reduce resistance in wiring as much as 25% and new materials will reduce chip capacitance by up to 3%. The mission is to ultimately enable equipment that can build a trillion-transistor chip such as a graphics processing unit. (Applied Materials, VentureBeat)

The Gold Label Alliance is composed of Chinese smart terminal manufacturers OPPO, vivo, Xiaomi, Alibaba, Baidu, TencentAn open, non-profit social organization voluntarily co-founded. Arm architecture CPU cores have been forced to adopt 64-bit since 2023, which also means that 32-bit instructions will be gradually eliminated. The full adaptation rate of the four software stores of the Gold Label Alliance members  OPPO, vivo, Xiaomi, and Lenovo has reached more than 99.1%, but there are still more than 4,100 (99% are not on the shelves) key applications that affect users’ daily lives that have not been adapted to 64-bit, a decrease of more than 700 from Jun 2024. After 31 Aug 2024, the four members of the Gold Label Alliance, OPPO, vivo, Xiaomi, and Lenovo, will gradually clean up 32-bit applications from the stores and implement relevant risk warnings and other measures for 32-bit applications that are no longer on the shelves.(CN Beta, Pasionate Geekz, Sohu, My Drivers)

Apple’s foldable concept allegedly “has moved beyond the conceptual stage” and is now “in development with supplier”.  The foldable phone is codenamed V68 and said to have a clamshell design like Samsung’s Galaxy Z Flip. Apple is reportedly still working to both make the V68 thinner and flatten the crease that appears when the handset is unfolded. Apple’s first “foldable iPhone potential release is targeted for 2026. (Digitimes, Android Headlines, The Information, The Verge, Tom’s Guide, 9to5Mac)

Huawei’s tri-fold phone will be equipped with the Kirin 9 series platform and adopt dual hinge technology. The display is expected to be around 10”. Huawei’s tri-fold phone is expected to be released in 4Q24. The production volume may be very small, and the starting price may exceed CNY15,000. In addition, new foldable phones from vivo and OPPO will be released as early as 1Q25, equipped with Qualcomm Snapdragon 8 Gen4 processors and built-in 6000mAh batteries. (Gizmo China, 36Kr, Sohu, Yahoo, IT Home)

Samsung will supply 48Mp camera image sensor (CIS) to Apple for its iPhone 18 Pro, according to TF Securities analyst Ming-chi Kuo. Kuo claims that Samsung is getting in on the iPhone camera business in 2 years, for the iPhone 18 Pro line. Samsung has spun off a dedicated team to serve Apple’s needs. Assuming Samsung’s CIS is approved, it will mean Sony losing its status as exclusive supplier for image sensors on the iPhone. Separately, Sony also reportedly lost its exclusive status as provider of screens for the Apple Vision Pro, because it reportedly refused to increase production capacity. (Apple Insider, Twitter)

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, announces upcoming standards for advanced memory modules designed to power the next generation of high-performance computing and AI applications.  JEDEC today revealed key details about its upcoming standards for DDR5 Multiplexed Rank Dual Inline Memory Modules (MRDIMM) and a next-generation Compression-Attached Memory Module (CAMM) for LPDDR6. (CN Beta, JEDEC)

Nvidia has reportedly certified Samsung’s high bandwidth memory (HBM) chips. Samsung’s HBM3 chips have received Nvidia’s approval for use in China. Its more advanced HBM3E solutions are still pending the Nvidia certification. Developed for the Chinese market, the H20 is made in compliance with export restrictions set by the US government. It was not immediately clear if Nvidia would use Samsung’s HBM3 chips in its other AI processors or if the chips would have to pass additional tests before that could happen. Samsung has also yet to meet Nvidia’s standards for fifth-generation HBM3E chips and testing of those chips is continuing. (Android Headlines, Reuters)

SK Hynix said it has decided to invest about KRW9.4T (USD6.8B) to build the first local chip factory in Yongin, South Korea. Kim Young-sik, head of manufacturing technology at SK Hynix, said the Yongin cluster will become the foundation for SK Hynix’s medium- and long-term development. The investment scale is expected to cover the construction of the first factory until the end of 2028, including utilities such as water and electricity as well as business support and welfare facilities. The company said it will include a “micro factory”, a research facility that can handle 30mm silicon wafers so that domestic chip material and equipment manufacturers can test their products in real-world environments. Prior to this, the company announced a plan in Apr 2024 to invest about USD3.87B to build an advanced packaging plant and artificial intelligence product R&D facility in Indiana, USA.(CN Beta, Business Korea, KED Global, YNA)

Infinix introduces its 720° SphereTech Near Field Communication (NFC) technology. While current NFC technology enables mobile payments and transit access, it often results in transaction failures and user frustration, particularly in crowded or fast-paced environments where precise alignment is necessary for successful interactions, which can be cumbersome and unreliable. The 720° SphereTech NFC technology introduces three breakthroughs in spatial layout, signal compatibility, and material type configuration. Infinix’s new NFC technology incorporates advanced encryption protocols and multi-layered authentication processes to safeguard all transactions and data exchanges against potential threats. Additionally, if a device is lost or stolen, the enhanced security features make it significantly more difficult for unauthorized users to access personal data or perform transactions.(Gizmo China, PR Newswire)

According to TM Roh, the President of Samsung’s Mobile Experience unit (MX), Samsung is focusing on AI as the future of mobile devices – we have already seen the software with the recent Galaxy AI features, but the hardware “may turn out to be radically different from Samsung’s existing phones”. He said that the “lion’s share” of Samsung MX’s research and development is focused on so-called AI phones. While Samsung views its current array of hardware as “sufficient” enough to handle AI, improved sensors and perhaps larger screens are in the cards. However, he refused to state what sort of design changes Samsung was interested in pursuing. (Android Central, Financial Review, GSM Arena, GizChina)

Foxconn is reportedly evaluating plans to assemble Apple’s flagship iPad in India. Foxconn may begin assembling iPads at its facility in Tamil Nadu’s Sriperumbudur. However, assembly of the “Mac range of laptops may take some time as the production volume is very small”. According to Isaiah Research, electric car maker BYD’s facility in Phu Tho, Vietnam, started assembling iPads in 2H22 and that as per their estimates, Vietnam accounts for about 5-10% of all iPad assembly. Additionally, Foxconn set up production lines in Bac Giang, Vietnam, to start assembling MacBooks. Foxconn will also gain from India’s production-linked incentives (PLI 2.0 for IT Hardware) which includes tablets, as it aggressively increases its investments in India. In Feb 2024, Foxconn said its Indian subsidiary would spend INR1,200 crore to build a factory that would come up on company-owned land. It is also building a mega factory outside Bengaluru, which is expected to primarily make iPhones. With iPhones, India has reached Completely Knocked Down (CKD) levels but with iPads, it is likely that they will have to start with Semi-Knocked Down (SKD) first for some time before reaching CKD levels. (Apple Insider, India Times)

Samsung’s official support page suggests that Samsung Galaxy Ring should be kept away from magnets. The page specifically states that “certain features, like step counting, may not work properly if you are holding a magnet or a magnetic object in the hand wearing the ring”. Samsung also recommends removing the Galaxy Ring during weightlifting and other exercises involving machines. The reasoning is twofold: to protect the ring itself and to prevent hand injuries. The support page mentions that wearing the ring during weightlifting “could cause hand injuries”, implying that the ring might get caught or damaged during strenuous exercise.(Gizmo China, Samsung, TechRadar, SamMobile)

Samsung has reportedly vastly increased the number of Galaxy Ring it plans to manufacture than initially in 2024 due to the positive reception of the device. The company initially planned to manufacture 400,000 units than adjust the volume after seeing the market reception for the smart ring. Samsung has now added 600,000 units to its initial stock, with the company informing its parts suppliers of the plan. (Android Central, Android Headlines, The Elec)

According to IDC, global AR shipments in 2023 is 480K units, up 74% YoY, and smart glasses shipments will be 1.01M units, up 128% YoY. In 1Q24, global AR glasses shipments will be 100K units, up 56% YoY, and smart glasses shipments will be 260K units, up 217% YoY. Compared with other consumer electronics categories, the industry’s current shipments are still at a relatively low level, but the industry’s growth rate in 1Q24 is impressive. From the perspective of AR, Chinese brands Xreal, Rokid, TCL Rayneo, and INMO have emerged in recent years. In terms of function, AR can be divided into viewing type (peripheral type) and information prompt type (integrated type). Xreal, Rokid, and Rayneo products are mainly peripheral type, generally using Micro-OLED + Birdbath / free-form surface optical solutions, and INMO products are mainly integrated, mainly using Micro-LED + diffraction optical waveguide solutions. (Sinolink Securities report)

In Sept 2021, Meta and Ray-Ban released the first generation of smart glasses, Ray-Ban Stories, which weighs less than 50g and starts at USD299. According to IDC, Ray-Ban Stories has shipped 800K units, mainly in 2021 (790K units). The product still has mediocre sales. In Sept 2023, Meta and Ray-Ban released their second generation product, Meta Ray-Ban, with the same shape and price. Neither of them is equipped with an optical screen, but has built-in directional speakers, microphones, cameras and other components, which can be used for FPV shooting/video recording, calls, listening to music, etc. In Apr 2024, Meta Ray-Ban launched the AI ​​function, which currently only supports English conversations and is only available to users in the United States and Canada. Users only need to say “HeyMeta” and say the prompt word or ask a question to activate the built-in AI assistant of the glasses, and then respond through the built-in speaker of the frame. According to IDC, Meta Ray-Ban shipments reached 360,000 and 100,000 units in 4Q23 and 1Q24 respectively; Ray-Ban Meta sales are expected to exceed 1M units by May 2024. (Sinolink Securities report)

According to Wellsenn XR, the comprehensive hardware cost of Ray Ban Meta, a collaboration between Meta and Ray-Ban, is about USD164. The cost of the SOC chip AR1 Gen 1 is about USD55, accounting for about 34%; the cost of ROM+RAM is about $11, accounting for about 7%; the cost of the camera is about USD9, accounting for about 5%; the cost of the battery is about USD6.5, accounting for about 4%, the cost of the PCB is about USD7.2, accounting for about 4%, and the cost of the acoustics is about USD5.5, accounting for about 3%. The hot sales of smart glasses are expected to drive the demand of assembly plants, chip plants, cameras, batteries, acoustics, PCBs and other industries. According to iResearch, referring to the BOM ratio of Hololens, the optical display unit in AR accounts for the highest proportion, reaching 43%, followed by the computing unit (31%), storage (15%), perception unit (9%), and battery (2%). (Sinolink Securities report)

Google-parent Alphabet is going all-in on autonomous vehicles, committing up to USD5B to fund its Waymo unit as the startup continues to test its driverless cars across the U.S. Waymo has served more than 2 million trips and driven more than 20 fully autonomous miles on public roads, according to Google. Companies like Motional, Cruise, Waymo, and Zoox have all made commendable progress in the segment but have each faced their fair share of adversity, whether it’s incidents with pedestrians, dwindling funding, or simply a public outpour of disdain and opposition from locals. (CN Beta, Electrek, TechCrunch, Quartz)

Stellantis is taking steps to fix weak margins and high inventory at its U.S. operations and will not hesitate to axe underperforming brands in its sprawling portfolio, accordin to its chief executive Carlos Tavares. The warning for lossmaking brands is a turnaround for Tavares, who has maintained since Stellantis was created in 2021 from the merger of Italian-American automaker Fiat Chrysler and France’s PSA that all of its 14 brands including Maserati, Fiat, Peugeot and Jeep have a future. Stellantis is the world’s fourth-largest automaker but managing so many car brands is proving to be difficult in an increasingly competitive industry. In Aug 2023, Stellantis was included in the 2023 Fortune Global 500 list, ranking 31st. It owns many well-known brands including Dodge, Peugeot, Citroen, Jeep, Chrysler, Maserati, Fiat, Alfa Romeo and others. (CN Beta, Motor1, Reuters)

Apple’s Apple Intelligence research team have released two new small but high-performing language models used to train AI generators. The Machine Learning team at Apple are taking part in an open-source DataComp for Language Models project alongside others in the industry. The two models Apple has recently produced have been seen to match or beat other leading training models, such as Llama 3 and Gemma. Apple’s submission to the project includes two models: a larger one with 7B parameters, and a smaller one with 1.4B parameters. Apple’s team said the larger model has outperformed the previous top model, MAP-Neo, by 6.6 percent in benchmarks. More remarkably, the Apple team’s DataComp-LM model uses 40 percent less computing power to accomplish those benchmarks. It was the best-performing model among those with open datasets, and competitive against those with private datasets.(CN Beta, Apple, Apple Insider)

SenseTime has recently inked a strategic cooperation agreement with China Unicom, pursuant to which the two companies will capitalize on their respective strengths to collaborate in the areas of digital communications, industry digital transformation, AI infrastructure, arithmetic service system and global arithmetic supply, to provide strong infrastructure support for AI industry development in the foundation model era.(Gizmo China, AAStock, SenseTime, IT Home)